Commerce Department Awards $11.6 Billion for Grants and Loans to Taiwan Semiconductor Manufacturing Company to Build Three Chip Fabrication Plants in Arizona
The U.S. Commerce Department announced plans to award Taiwan Semiconductor Manufacturing Co. (TSMC) $6.6 billion in grants and as much as $5 billion in loans from the SWACCA-supported CHIPS and Science Act to help build chip factories and related facilities in Arizona.
Under the preliminary agreement, TSMC will construct a third factory in Phoenix, Arizona, adding to two facilities in the state that are expected to begin construction in 2025 and 2028. In total, the package will support more than $65 billion in investments at the three plants by TSMC.
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