March 5, 2024

The U.S. Army Corps of Engineers (USACE) announced its intent to prepare an environmental impact statement (EIS), and host a related public scoping meeting, in connection with an application from Micron New York Semiconductor Manufacturing LLC (Micron) to construct a semiconductor manufacturing facility for leading-edge manufacturing of dynamic random-access memory (DRAM) chips in the Town of Clay, Onondaga County, New York.

Specifically, the project would be constructed over a 20-year period and consists of: (1) construction of the Micron Campus, which will include four individual memory fabrication units (fabs), ancillary support facilities, driveways, and parking; (2) construction of a childcare and health care center located at 9100 Caughdenoy Road, Brewerton, NY; (3) construction of a connection to the National Grid substation, adjacent to the Micron Campus, and (4) a rail spur on the west side of Caughdenoy Road adjacent to the proposed facility. Micron intends to start construction of the Micron Campus in 2025, with two fabs (Fabs 1 and 2) becoming operational by 2029 and two more fabs (Fabs 3 and 4) becoming operational by 2041.

Moreover, Onondaga County plans to improve the water supply and wastewater infrastructure to support operations of the manufacturing plant and the National Grid utility company plans to upgrade the energy infrastructure to support the project.

Comments can be submitted at any time by email to celrb-micron.public.comments@usace.army.mil. USACE will host a public scoping meeting in connection with the EIS on March 19, 2024 at 7pm ET in-person at the Town of Clay - Town Hall Board Room, 4401 Route 31, Clay, NY 13041. There is no stated requirement to RSVP to attend the meeting.

© 2024 Signatory Wall and Ceiling Contractors Alliance (SWACCA). All rights reserved.